• 4GB to 32GB capacities
• 0°C to +70°C temp range standard
• -40°C to +85°C temp range option
• Read Seq. up to 105MB/s
  
• Write Seq. up to 90MB/s
• 3.3V powered
• Completely solid state
• Wear leveling algorithms
• Bad block management
• CFast™ Spec. Rev. 1.0, CE / FCC
• RoHS compliant
• 3 year warranty

A CFast to SATA adapter board is also available. This allows connection of CFast cards to a standard desktop PC via standard SATA cables (7 pin power and 15 pin data cables). The assembly is compatible with a standard 2.5" disk.

The CBP Modules products come in capacities of 10, 58.33, 250, and 500 Farads and can supply back-up power to a twenty Watt load for 0.73 minutes through 44.47 minutes respectively.

• 10 to 500 farad total capacity
• 16.2 volt maximum voltage (module)
• -40°C to +65°C operating tem
• -40°C to +70°C storage temp
• PC/104 footprint
• 500,000 charge cycles
• Not affected by deep discharges
• Quick charge
• Combine with Tri-M HESC series power supply for a no-battery UPS
• ROHS compliant

The CBP modules are designed for use with the Tri-M HESC range of power supplies such as the HESC104, HESC104+ or HESC-SER.

The VDX104plus features an 800MHz DM&P Vortex86DX System-on-Chip (SoC) high performance and fully static 32-bit X86 processor designed to work with embedded operating systems including Windows®CE, Linux, DOS, and most popular 32-bit RTOS.

Interfaces include:

• 4x 16550-compatible serial ports, RS-232
• 2x 10/100 Ethernet
• 1x IDE
• 1x parallel
• 2x USB2.0
• PS/2 keyboard/mouse
• 1x 8 bit GPIO
• 1x External SPI port
• Type I CompactFlash socket
• microSD socket
• 16MB onboard SPI flash (floppy emulation)
• IDE interface

The VDX104+ is a compact design measuring 3.55" x 3.775" x 0.9" and has an operating temperature of -40°C to +85°C. Single +5VDC power is supplied through the PC/104 bus or 2-position screw terminal and total power consumption is a mere 2.5 Watts.

The E902 chassis utilizes a bonded and fastened construction technique and is made of durable CNC machined 6061-T6 aluminum. Stepped corner joints enhance the structural and EMI integrity. All fasteners are stainless steel and removable panel threaded holes have self-locking stainless steel helicoils to withstand severe vibration and shock.

Aitech's E902 minimizes radiated emissions and susceptibility interference with these features:

• Bolted corners with conductive surfaces provide 2.5 milliohms or less of DC resistance
• Conductive O-ring gaskets provide environmental and electro-magnetic sealing
• Separately shielded input power assembly
• Ferrite suppression on the input power assembly eliminate conducted emissions

The E902 is sealed against intrusion of external environment contaminants found in military applications, including: humidity, sand and dust, and contaminant splash. Conductive EMI gaskets are installed around each of the front panel connector. Enclosure mating surfaces are sealed with silicon rubber O-ring seals.

• Rugged 2 slot, 3U CompactPCI Powered Enclosure
• Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses
• Environmentally and EMI Sealed Enclosure for Conduction-Cooled Modules
• Compact for 2 Standard ANSI/VITA 30.1-2002 Conduction Cooled, 3U CompactPCI Modules
• Conduction-cooled via Chassis Baseplate
• 28Vdc Power Input per MIL-STD-704 with Environmentally Sealed, EMI/EMC Compliant Power Input Filter
• Standard Output,High Performance, Modular and Removable Power Supply
• Customized Front Panel – D-Sub Connectors

M224 memory comprises two banks of NAND Flash devices providing a maximum total capacity of 128 GB. Each Flash bank is managed by its own SSD controller, enabling operation as an independent SATA II Flash disk. The SSD controllers' built-in bad block management, wear leveling, and error correction ensure reliable high speed operation and minimize the burden on the host processor.

• Single width Rugged PMC/XMC
• Complete SATA based solution
• Up to 128 GByte NAND Flash Capacity
• Automatic PCI/PCI-X/PCIe Configuration
• PCIe Interface x1 Lane (XMC)
• PCI/PCI-X 64-bit @ 33/66/100/13 MHz i/f (PMC)
• Built-in RAID supporting RAID 0, 1 & JBOD
• Up to 120 MB/s sustained write
• Up to 170 MB/s sustained read<
• Built-in ECC, Wear Leveling, and Bad Block Management
• External Write Protect Support
• VxWorks, Windows & Linux support
• IEEE 1386-2001 (Air Cooled PMC) or
• VITA 20-2001 (Conduction Cooled PMC) or
• ANSI/VITA 42.0-2008 (XMC)
• Commercial/Military Level Ruggedization
• Vibration and Shock Resistant

• Up to 10.5TB per memory shelf
• Up to 1.4GB/sec bandwidth per shelf
• 350K Random Read IOPS per shelf
• 220K Sustained Random Write IOPS per shelf
• 24 Bit Error Correction per 4K block
• Multiple redundancies built in
• Managed like simple block storage
• Network head available - can handle up to 4 shelves

Contact us for further details.

• Intel® Atom™ N270 1.6 GHz
• 1GB/533 DDR2 soldered memory
• Fanless operation
• 2 x 10/100/1000Mbps Ethernet
• Intel® 945GSE integrated graphics
• VGA & Dual-channel 18bit LVDS
• 2x SATA, IDE & Compact Flash socket
• 4 x USB2.0, 2 x RS-232, 2 x RS-422/485
• GPIO
• -40° to 80°C operation
• RoHS Compliant

The unit is houses in a ruggedized metal enclosure and provides visual LED indication of power, USB ready and data transmit/receive per individual port.

Diamond Systems CME-Atom features either an Intel Atom Z510 with 1GB of soldered DDR2 memory or the Intel Atom X530 with 2GB of soldered DDR2 memory. The module with Z510 has a -20°C to +71°C operating range whereas the Z530 module has a -40°C to +85°C operating range.

Diamond Systems CME-965 features the Intel 1.66GHz Core Duo LV CPU, up to 4GB DDR (via SODIMM) memory and has a -40°C to +85°C operating temperature range.

In addition to the CME-965 COMs themselves, Diamond offers pre-integrated development kits based on generic or application-oriented COM Express baseboards. This increases project efficiency and reduces risks by providing a known good environment for rapid application development.

To simplify the development process, these kits’ COM Express baseboards each provide I/O connectors for quick and easy access to nearly all system interfaces. They also come with SO-DIMM memory, an extensive set of interface cables, and full documentation and software.

Diamond Systems ETX-N270 features the Intel Atom N270 at 1.6GHz, up to 2GB DDR (via SODIMM) memory and has a -20°C to +71°C operating temperature range.

Diamond Systems ETX-945 features the Intel 1.66GHz Core Duo LV CPU, up to 2GB DDR (via SODIMM) memory and has a -40°C to +85°C operating temperature range.

In addition to the ETX-945 COMs themselves, Diamond offers pre-integrated development kits based on generic or application-oriented ETX baseboards. This increases project efficiency and reduces risks by providing a known good environment for rapid application development.

To simplify the development process, these kits' ETX baseboards each provide I/O connectors for quick and easy access to nearly all system interfaces, a CompactFlash socket, and modular PC/104-Plus expansion. They also come with SO-DIMM memory, an extensive set of interface cables, and full documentation and software.

Also available from Connect Tech is a PCI Express to FeaturePak adapter card, which allows FeaturePak boards to be used/developed on desktop PCs with a free PCIe slot.

Processor and Peripherals

• Low Power 1.6 GHz Intel Atom N270
• 2 GB DDR2 SDRAM
• 533 MHz Front Side Bus (FSB)
• 4 to 8 GB Solid State Drive (SSD)

Standard PC I/O

• (2) Gigabit Ethernet Ports
• (6) High Speed USB 2.0 Ports
• PS/2 Keyboard & Mouse Ports
• (2) RS-232 Serial Ports
• (2) RS-232/422/485 Serial Ports
• Dual Video output / Stereo Audio (in/out)
• I/O wired to standard -38999 connectors

Temperature range (operation):

• Passive/free air: -55°C to +55°C
• Coldplate: -55°C to +71°C

The standard CompactPCI® boards are fitted into a special "CCA" frame (conduction cooled assembly) and inserted into the system. The system provides three CompactPCI® slots for one CPU board with a side card and one I/O board, as well as a PSU slot with an H15 connector. The distance between the slots on the backplane is greater than on standard backplanes. The thermal resistance is 0.4 Kelvin/Watt and the temperature class Tx for 40 W maximum performance (for boards with an operating temperature of -40 to +85°C). The enclosure is compliant with IP65 for protection against dust and humidity.

The system is suited for MEN boards F11S, F12N, F13, F14, F15, F17, F18, F19P and F50C.

The memory configuration of the G20 includes a state of the art fast DDR3 DRAM which is soldered to the board to guarantee optimum shock and vibration resistance. A robust CompactFlash® and microSD™ card device which are connected via a USB interface offer nearly unlimited space for user applications. The board delivers an excellent graphics performance. Two DisplayPort interfaces are accessible at the board front. Using an external adapter two HDMI or two DVI ports can also be realized. In addition the standard front I/O comprises two PCIe®-driven Gigabit Ethernet and two USB 2.0 ports.

Serial interfaces at the rear I/O connectors are 8 USB, 6 SATA interfaces, one DisplayPort or HDMI (instead of one interface at the front panel), 5 PCI Express® x1 links, a PEG x8 and a PEG x4 link. Thermal supervision of the processor and a watchdog for the operating system complete the functionality of the G20.

The G20 operates in Windows® and Linux environments as well as under real-time operating systems that support Intel®'s multi-core architecture. The InsydeH2O™ EFI BIOS was specially designed for embedded system applications.

The G20 is suited for a wide range of industrial applications, e.g. for monitoring, vision and control systems as well as test and measurement. Main target markets comprise industrial automation, multimedia, traffic and transportation, aerospace, shipbuilding, medical engineering and robotics.

The G20 comes with a tailored passive heat sink within 4 HP height. Regardless, forced air cooling is always required inside the system. The robust design of the G20 makes the board especially suited for use in rugged environments with regard to shock and vibration according to applicable DIN, EN or IEC industry standards. The G20 is also ready for coating so that it can be used in humid and dusty environments and has a guaranteed minimum standard availability of 7 years.

Magellan's CPU core consists of a COM Express CPU module and heatspreader mounted on its bottom side, resulting in optimal thermal management and increased space for I/O functions and connectors. This innovative design makes it possible for Magellan to integrate dual gigabit Ethernet LAN ports, a 7-30V DC/DC power supply, a full set of peripheral interface header connectors, stackable PCI-104 or SUMIT expansion, and a FeaturePak socket, in addition to a complete embedded-PC core -- all within the 95mm x 125mm COM Express footprint.

Magellan is offered in a range of models that vary according to the choice of COM Express CPU module and SDRAM capacity (socketed or soldered-on). It can be used either as a highly integrated embedded component, or as a platform for application development and reference designs.

The Magellan baseboard layer includes connectors and interfaces for USB, serial, gigabit Ethernet, audio, and SATA mass storage devices. It supports the connection of a wide variety of displays, including CRTs, LVDS-interfaced flat panels, and televisions. Power is supplied by means of a robust six-pin terminal block.

What is an 'Embedded-Ready Subsystem (ERS)'?

An Embedded-Ready Subsystem (ERS) combines the high-performance processing and leading-edge system I/O capabilities of computer-on-modules (COMs) with the modular expansion flexibility of stackable single board computers, all within a single compact, rugged, reliable, pre-integrated module. Additionally, the modules' large thermally-conductive baseplate provides both an efficient cooling solution and a standardized mounting-hole pattern that ensures interchangeability for alternate features or performance upgrades.

An ERS consists of three layers, as illustrated below. The central core of the ERS is its COM layer. Below the COM layer is the thermally-conductive baseplate layer. Above the COM layer is the application layer, which provides I/O interface connectors, expansion module sockets, and in many cases additional functionality

This innovative design provides optimal theremal management, and makes it possible for the ERS to integrate complete embedded-PC functionality plus a full set of peripheral interface header connectors, stackable PC/104-style expansion, a FeaturePak socket, an on-board flashdisk, and extra feaures such Ethernet interfaces, serial ports, and an on-board DC/DC power supply -- all within compact form-factors such as the 95mm x 125mm COM Express footprint. These highly integrated board-level subsystems can be used as plug-and-play embedded components, or as platforms for application development and reference designs.

The Kontron ETXexpress®-AI is available with:

• 1.06 GHz Intel® Core™ i7 620UE Processor
• 2.00 GHz Intel® Core™ i7-620LE Processor
• 2.40 GHz Intel® Core™ i5-520E Processor
• 2.53 GHz Intel® Core™ i7-610E Processor

All versions support up to 2 x 4 GB of dual channel DDR3 SO-DIMM modules with ECC and offer a comprehensive range of interfaces via the COM Express™ COM.0 Type 2 connector: 1x PCI Express Gen 2 graphics (PEG) (also configurable as 2x PCIe x8), 6x PCI Express x1, 4x Serial ATA, 1x PATA, 8x USB 2.0, Gigabit Ethernet, dual-channel LVDS, VGA and Intel® High Definition Audio. Additionally, older non-PCI Express-compliant components can be incorporated via the integrated PCI 2.3 interfaces. The integrated Intel® AMT 6.0 Active Management Technology enables out-of-band remote management. An 8V–18V universal power supply for simplified power distribution rounds out the feature set.

The microETXexpress®-XL is based on the energy-saving Intel® Atom™ processor Z520PT (1.33GHz) and the Intel® US15WPT System Controller Hub. The module offers PCI as well as more sophisticated graphics support with SDVO. Via the PCI Express Graphics pin-out, SDVO delivers additional video signals for DVI monitor outputs, SDTV and HDTV television outputs and TV tuner inputs that greatly simplify system graphics design. This special feature makes this 95 x 95 mm computer-on-module ideal for small mobile and extremely energy-efficient devices including those used in government/ military and transportation applications.

Other standard features of the microETXexpress®-XL include: Gigabit Ethernet, Serial ATA, single-channel LVDS and USB 2.0. All Kontron microETXexpress® family modules are compatible with the COM Express™ standard allowing for easy interchangeability and ensuring design scalability and future migration paths.

Both modules are initially available populated with the Trimble Condor GPS receiver.

• Lowers development risk, cost and time
• Custom form factors to suit specific integration requirements
• Shortens time-to-market for new navigation products
• Extended temperature operation as standard
• GPS L1 Frequency C/A Code Receiver
• NMEA Output and Input
• SBAS (WAAS, EGNOS) Capable
• aGPS Capable
• Update Rate up to 10 Hz
• PPS Timing Output
• Multiple Form Factors and Interface Options
• From 10 mm x 11 mm in size