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Kontron COMe-AI# (ETXexpress-AI)High Performance COM Express™ with Intel® Core™ i7/i5Speeds to 2.53GHz (Dual Core), Up To 8GB DDR3 Memory, SATA RAID |
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Datasheet/Manual:
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IntroductionThe Kontron COMe-AI# COM Express™ Computer-on-Module offers OEMs a new level of design flexibility thanks to its 32 nm Intel Core i7 / Core i5 processor technology, high energy efficiency, wide graphics support, customizable PCI Express configuration and ECC dual channel RAM to ensure data accuracy. The COMe-AI# Computer-on-Module offers improved computing and graphics performance in the high- end performance sector. The board features the processor-integrated 45nm Intel® HD graphics with DisplayPort support. Especially graphics-intensive applications will benefit from Open GL 2.1 support and accelerated DirectX 10 capabilities through better and faster visual display. Hence, the new Computer-on-Module is able to achieve up to 2.6 times the graphics performance in comparison to Mobile Intel® GM45 and GS45 Express based solutions (according to 3DMark 2006). For safety-critical applications, the Kontron COMe-AI# integrates up to 8 GB of ECC system memory and an optional Trusted Platform Module (TPM). The performance of the new Computer-on-Modules is scalable right from the start with a choice of four different Intel® Core™ i7 or Core™ i5 processors. By integrating the latest 32 nm processor technology for power use efficiency, higher bandwidth, and greater integration, the Kontron COMe-AI# COM raises the performance bar compared to solutions based on embedded Intel® Core™ 2 Duo processors. The new module not only speeds up multiprocessing tasks via hyper-threading technology (HTT), but also processes single-threaded tasks much faster thanks to the new Intel® Turbo Boost technology. Depending on the processor, this allows individual cores to operate between 25% and 100% above the nominal clock speed without exceeding the defined TDP. OEMs in markets such as gaming, digital signage, network/telecommunications, automation, medical and MAG (military, aerospace, government) who require application-specific customization continue to take advantage of optimized time-to-market and now have an even more secure upgrade path to grow their application’s capabilities today and onto future generations. The Kontron COMe-AI# is available with:
All versions support up to 2 x 4 GB of dual channel DDR3 SO-DIMM modules with ECC and offer a comprehensive range of interfaces via the COM Express™ COM.0 Type 2 connector: 1x PCI Express Gen 2 graphics (PEG) (also configurable as 2x PCIe x8), 6x PCI Express x1, 4x Serial ATA, 1x PATA, 8x USB 2.0, Gigabit Ethernet, dual-channel LVDS, VGA and Intel® High Definition Audio. Additionally, older non-PCI Express-compliant components can be incorporated via the integrated PCI 2.3 interfaces. The integrated Intel® AMT 6.0 Active Management Technology enables out-of-band remote management. An 8V–18V universal power supply for simplified power distribution rounds out the feature set. Note: this module was previously known as the ETXexpress-AI. Heatspreader Concept
Kontron have two different heatspreaders for this COMexpress module. One with threaded post and one with through hole posts. Kontron also have two heatspreader/heatsink assemblies (again one threaded, one through hole). For the active cooled version, the fan is recessed into the heatsink. Drawings of all four assemblies are available on request. |
Specification |
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Compliance: |
Fully COM Express™ Type 2 or Type 6 compliant |
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CPU: |
Intel® Core™ i7 SV (2.53GHz, 4M L2) |
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Chipset: |
Intel® Mobile QM57 Platform Controller Hub |
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DRAM: |
Up to 8 GB DDR3 SO-DIMM 800/1066 dual channel (two sockets) with ECC support |
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Cache: |
See CPU |
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Drives: |
Type 2 module: 4x SerialATA 300 (AHCI; RAID 0,1,10,5), 1x PATA |
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Ethernet: |
10/100/1000 MBit |
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I/O Ports: |
USB 8x USB 2.0 Ports for external peripherals |
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Graphics: |
Intel® GMA X4500 integrated in Intel® GS45 (DirectX® 10, PS 4.0, DVMT 4.0)
1 PEG x16 |
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Other: |
Intel® High Definition Audio |
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Expansion: |
Type 2 module:
Type 6 module:
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Size: |
95 x 125mm |
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Operating Systems: |
Compatible Operating Systems |
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Power: |
Voltage: Wide range power input from 8 V - 18 V
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Environment: |
Temperature operation: 0° to 60°C, storage: -10° to
85°C |
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ROHS Status: |
This product is lead free/ROHS compliant. |
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| Ordering Details: | |
Board: |
COM Express™ Pin-out Type 2 modules: Note: All current ETXexpress-AI require ECC memory to be used. Non ECC variants are planned. Please note that boards are supplied with no cables, software or
manuals. |
Accessories: |
Kontron DDR3 SODIMM DRAM: 38010-0000-99-0C01 Active cooling solution for COMe-bAI#, threaded mounting holes 38017-0000-00-5 COM Express® Mounting Kit 5mm 1set for threaded HSP and Cooling Solutions 38106-0000-00-0 COM Express® Eval Carrier Type 6 |
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ORDER ONLINE - these products are available to order on our online webshop. |
Further Information: |
Want further information or pricing on this product? Either fill out our feedback form or contact us for further information. |
© 2012 Diamond Point International. All rights reserved. |



The
heat-spreader is a 2mm thick aluminium plate. It provides a thermal
interface surface for heat removal from the COMexpress module. The heat-spreader
is thermally coupled to the CPU die or package surface, and it may
also be coupled to other heat generating devices on the module (e.g.
chipset, vga chip). The heat spreader is not intended as a heat
sink, although it may be suitable for this purpose on low power
modules operating under benign conditions. Higher power modules
or higher temperature conditions will probably require heat removal
devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.)
to be attached to the heatspreader, or it may need to be thermally
coupled to a chassis.