Diamond Point International
 
Kontron Embedded Modules

Kontron COMe-AI# (ETXexpress-AI)

High Performance COM Express™ with Intel® Core™ i7/i5

Speeds to 2.53GHz (Dual Core), Up To 8GB DDR3 Memory, SATA RAID

 
Kontron COMe-AI
 
  • Intel® Core™ i7 SV (2.53GHz, 4M L2) 32nm
  • Intel® Core™ i5 SV (2.40GHz, 3M L2) 32nm
  • Intel® Core™ i7 LV (2.0GHz, 4M L2) 32nm
  • Intel® Core™ i7 ULV (1.06GHz, 4M L2)
  • DDR3-SDRAM up to 8GB
  • 6 PCI-Express x1 lanes
  • 1 PCI Express Graphic x16 lanes
  • PCI 2.3, 32bit, 66MHz
  • Windows Vista Support
  • Onboard video with LCD support
  • 8x USB 2.0 & Intel® high definition audio
  • 4x SerialATA 300 (AHCI; RAID 0,1,10,5)
  • TV-out and sound
  • 10/100/1000Base-T Ethernet
  • Evaluation/adapter board available



Datasheet/Manual:

Kontron COMe-AI# datasheet in PDF format COMe-AI# Datasheet - PDF
Kontron COMe-AI# manual in PDF format COMe-AI# Manual - PDF
Kontron COM Benchmarks and Power Consumption in PDF format COM Performance/Power Compare - PDF
Computer-on-Modules Overview 02/2012
COM Overview 2012 - PDF

COM Express Concept Whitepaper in PDF format COM Express Concept Whitepaper - PDF
COM Express Concept Whitepaper in PDF format COM Express Design -PDF

 

Introduction

The Kontron COMe-AI# COM Express™ Computer-on-Module offers OEMs a new level of design flexibility thanks to its 32 nm Intel Core i7 / Core i5 processor technology, high energy efficiency, wide graphics support, customizable PCI Express configuration and ECC dual channel RAM to ensure data accuracy. The COMe-AI# Computer-on-Module offers improved computing and graphics performance in the high- end performance sector.

The board features the processor-integrated 45nm Intel® HD graphics with DisplayPort support. Especially graphics-intensive applications will benefit from Open GL 2.1 support and accelerated DirectX 10 capabilities through better and faster visual display. Hence, the new Computer-on-Module is able to achieve up to 2.6 times the graphics performance in comparison to Mobile Intel® GM45 and GS45 Express based solutions (according to 3DMark 2006).

For safety-critical applications, the Kontron COMe-AI# integrates up to 8 GB of ECC system memory and an optional Trusted Platform Module (TPM). The performance of the new Computer-on-Modules is scalable right from the start with a choice of four different Intel® Core™ i7 or Core™ i5 processors. By integrating the latest 32 nm processor technology for power use efficiency, higher bandwidth, and greater integration, the Kontron COMe-AI# COM raises the performance bar compared to solutions based on embedded Intel® Core™ 2 Duo processors. The new module not only speeds up multiprocessing tasks via hyper-threading technology (HTT), but also processes single-threaded tasks much faster thanks to the new Intel® Turbo Boost technology. Depending on the processor, this allows individual cores to operate between 25% and 100% above the nominal clock speed without exceeding the defined TDP. OEMs in markets such as gaming, digital signage, network/telecommunications, automation, medical and MAG (military, aerospace, government) who require application-specific customization continue to take advantage of optimized time-to-market and now have an even more secure upgrade path to grow their application’s capabilities today and onto future generations.

The Kontron COMe-AI# is available with:

  • 1.06 GHz Intel® Core™ i7 620UE Processor
  • 2.00 GHz Intel® Core™ i7-620LE Processor
  • 2.40 GHz Intel® Core™ i5-520E Processor
  • 2.53 GHz Intel® Core™ i7-610E Processor

All versions support up to 2 x 4 GB of dual channel DDR3 SO-DIMM modules with ECC and offer a comprehensive range of interfaces via the COM Express™ COM.0 Type 2 connector: 1x PCI Express Gen 2 graphics (PEG) (also configurable as 2x PCIe x8), 6x PCI Express x1, 4x Serial ATA, 1x PATA, 8x USB 2.0, Gigabit Ethernet, dual-channel LVDS, VGA and Intel® High Definition Audio. Additionally, older non-PCI Express-compliant components can be incorporated via the integrated PCI 2.3 interfaces. The integrated Intel® AMT 6.0 Active Management Technology enables out-of-band remote management. An 8V–18V universal power supply for simplified power distribution rounds out the feature set.

Operating system support is offered for Windows 7®, Windows XP, Linux (including Red Hat Enterprise, SuSE, Red Flag and Wind River Linux) and VxWorks.

Note: this module was previously known as the ETXexpress-AI.

Heatspreader Concept

ETX heatspreaderThe heat-spreader is a 2mm thick aluminium plate. It provides a thermal interface surface for heat removal from the COMexpress module. The heat-spreader is thermally coupled to the CPU die or package surface, and it may also be coupled to other heat generating devices on the module (e.g. chipset, vga chip). The heat spreader is not intended as a heat sink, although it may be suitable for this purpose on low power modules operating under benign conditions. Higher power modules or higher temperature conditions will probably require heat removal devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.) to be attached to the heatspreader, or it may need to be thermally coupled to a chassis.

Kontron have two different heatspreaders for this COMexpress module. One with threaded post and one with through hole posts. Kontron also have two heatspreader/heatsink assemblies (again one threaded, one through hole). For the active cooled version, the fan is recessed into the heatsink. Drawings of all four assemblies are available on request.

 

Specification

Compliance:

Fully COM Express™ Type 2 or Type 6 compliant

CPU:

Intel® Core™ i7 SV (2.53GHz, 4M L2)
Intel® Core™ i5 SV (2.40GHz, 3M L2)
Intel® Core™ i7 LV (2.0GHz, 4M L2)
Intel® Core™ i7 ULV (1.06GHz, 4M L2)
Refer to the ETXexpress Product Line Performance document for benchmark figures
To compare the processor range, refer to the Intel website

Chipset:

Intel® Mobile QM57 Platform Controller Hub

DRAM:

Up to 8 GB DDR3 SO-DIMM 800/1066 dual channel (two sockets) with ECC support
800/1066 FSB

Cache:

See CPU

Drives:

Type 2 module: 4x SerialATA 300 (AHCI; RAID 0,1,10,5), 1x PATA
Type 6 module: 4x SerialATA 300 (AHCI; RAID 0,1,10,5) only

Ethernet:

10/100/1000 MBit

I/O Ports:

USB 8x USB 2.0 Ports for external peripherals

Graphics:

Intel® GMA X4500 integrated in Intel® GS45 (DirectX® 10, PS 4.0, DVMT 4.0) 1 PEG x16
LVDS up to UXGA (1600x1200), CRT up to QXGA (2048x1536)
Single and Dual Channel LVDS 18/24 bit
Type 2 module: VGA, LVDS, PEG multiplexed w/ embedded DisplayPort
Type 6 module: VGA, LVDS, 3x DDI (SDVO/DP/DVI/HDMI), PEG multiplexed w/ embedded DisplayPort

Other:

Intel® High Definition Audio
TPM 1.2 integrated in ICH9M
Suspend Modes (S1, S3, S4, S5)
Power Management ACPI 2.0 (Advanced Configuration and Power Interface)
Watchdog Timer

Expansion:

Type 2 module:

  • 6 PCI Express x1 (1 PCI Express x4 possible), 1 PEG x16 (type 2 module)
  • PCI 2.3, 32 bit / 33 MHz PCI bus

Type 6 module:

  • 7 PCI Express x2, 1 PEG x16
  • No PCI

See ETXexpress information page for more info

Size:

95 x 125mm

Operating Systems:

Compatible Operating Systems
Windows 7 (32bit and 64bit)
Windows Vista (32bit and 64bit)
Windows® XP
Windows® XP Embedded
Windows® XP
Linux
Contact us for others

Power:

Voltage: Wide range power input from 8 V - 18 V
Power Consumption:

 

100% CPU load
all cores, WinXP

50% CPU load on
one core, WinXP

Working (S0/G0)
WinXP Idle

Standby
(STR, S3)

Soft Off
(S5/G2)

Intel® Core™ i7 SV
2.53GHz, 4M L2

42.72W

24.72W

14.64W

1225mW

620mW

Intel® Core™ i5 SV
2.40GHz, 3M L2

42.60W

22.92W

12.72W

1345mW

610mW

Intel® Core™ i7 LV
2.0GHz, 4M L2

34.32W

17.64W

12.36W

1150mW

615mW

Intel® Core™ i7 ULV
1.06GHz, 4M L2

21.12W

24.72W

12.72W

1240mW

630mW

Environment:

Temperature operation: 0° to 60°C, storage: -10° to 85°C
Humidity operation: 10% to 90%, storage: 5% to 95% (non condensing)

ROHS Status:

This product is lead free/ROHS compliant.


Ordering Details:

Board:

COM Express™ Pin-out Type 2 modules:
38010-0000-25-2
COMe-bAI2 with Intel® Core™ i7-610E 2x2.53GHz, QM57 PCH, 2x DDR3 ECC SO-DIMM socket
38010-0000-24-2 COMe-bAI2 with Intel® Core™ i5-520E 2x2.40GHz, QM57 PCH, 2x DDR3 ECC SO-DIMM socket
38010-0000-20-2 COMe-bAI2 with Intel® Core™ i7-620LE 2x2.00GHz, QM57 PCH, 2x DDR3 ECC SO-DIMM socket
38010-0000-18-1 COMe-bAI2 with Intel® Celeron® P4505 2x1.86GHz, QM57 PCH, 2x DDR3 ECC SO-DIMM socket
38010-0000-11-2 COMe-bAI2 with Intel® Core™ i7-620UE 2x1.06GHz, QM57 PCH, 2x DDR3 ECC SO-DIMM socket

Note: All current ETXexpress-AI require ECC memory to be used. Non ECC variants are planned.

Please note that boards are supplied with no cables, software or manuals.
Software/manuals are available electronically.

Accessories:

Kontron DDR3 SODIMM DRAM:
97016-1024-13-0
DDR3-SODIMM-1GB - DDR3 SDRAM SODIMM ECC memory module with 1GB 0° to 60°C
97016-2048-13-0 DDR3-SODIMM-2GB - DDR3 SDRAM SODIMM ECC memory module with 2GB 0° to 60°C
97016-4096-13-0 DDR3-SODIMM-4GB - DDR3 SDRAM SODIMM ECC memory module with 4GB 0° to 60°C

38010-0000-99-0C01 Active cooling solution for COMe-bAI#, threaded mounting holes
38010-0000-99-0C02 Passive cooling solution for COMe-bAI# pin-out Type 2 and type 6, threaded mounting holes
38010-0000-99-0 Heatspreader for COMe-bAI#, threaded mounting holes
38010-0000-99-1 Heatspreader for COMe-bAI#, through holes

38017-0000-00-5 COM Express® Mounting Kit 5mm 1set for threaded HSP and Cooling Solutions
38017-0000-00-0 COM Express® Mounting Kit 8mm 1set for threaded HSP and Cooling Solutions
38017-0100-00-0 COM Express® Mounting Kit 8mm 100sets

38110-0072-05-0
COM Express® Connector Baseboard 5mm 2x220 pin 72 pcs
38110-0054-08-0 COM Express® Connector Baseboard 5mm 2x220 pin 72 pcs

38106-0000-00-0 COM Express® Eval Carrier Type 6
38104-0000-00-1 COM Express® Eval Carrier Type 2
38102-0000-00-1 COM Express® Reference Carrier Type 2

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Further Information:

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