Kontron microETXexpress-XL

Introduction

The Kontron microETXexpress®-XL, a COM Express™ pin-out type 2 compatible computer-on-module, is truly designed for use in extreme conditions. Each component is selected with the industrial temperature range of -40 to +85°C in mind as well as the necessary tolerances for high reliability with respect to shock and vibration resistance.

The microETXexpress®-XL is based on the energy-saving Intel® Atom™ processor Z520PT (1.33GHz) and the Intel® US15WPT System Controller Hub. The module offers PCI as well as more sophisticated graphics support with SDVO. Via the PCI Express Graphics pin-out, SDVO delivers additional video signals for DVI monitor outputs, SDTV and HDTV television outputs and TV tuner inputs that greatly simplify system graphics design. This special feature makes this 95 x 95 mm computer-on-module ideal for small mobile and extremely energy-efficient devices including those used in government/ military and transportation applications.

Other standard features of the microETXexpress®-XL include: Gigabit Ethernet, Serial ATA, single-channel LVDS and USB 2.0. All Kontron microETXexpress® family modules are compatible with the COM Express™ standard allowing for easy interchangeability and ensuring design scalability and future migration paths.

Heatspreader Concept

The heat-spreader is a 2mm thick aluminum plate. It provides a thermal interface surface for heat removal from the ETX module. The heat-spreader is thermally coupled to the CPU die or package surface, and it may also be coupled to other heat generating devices on the module (e.g. chipset, vga chip). The heat spreader is not intended as a heat sink, although it may be suitable for this purpose on low power modules operating under benign conditions. Higher power modules or higher temperature conditions will probably require heat removal devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.) to be attached to the heatspreader, or it may need to be thermally coupled to a chassis.