Diamond Systems FEATUREPAK-DAQ1616

Introduction

FeaturePak-DAQ1616 is a data acquisition I/O card integrating Diamond's newest and fastest analog I/O technology and a PCI Express host interface.

This tiny board offers 16-bit A/D sampling at 2MHz, supported with an expanded 16K-sample FIFO for reliable data collection in any operating system. Analog output capability has been expanded to 16 16-bit channels with programmable output ranges. All analog I/O features are enhanced with our industry-leading autocalibration technology, featuring independent calibration factors for each input and output range to guarantee maximum accuracy across all operating modes and the entire operating temperature range.

Digital I/O features include seven 8-bit ports with both bit-wide and byte-wide direction control, two 32-bit up/down counter/timers with programmable input source and gate, four 24-bit pulse-width modulation circuits with 0-100% duty cycle, and a watchdog timer. The board is available in analog I/O and analog out-only configurations.

Block Diagram

Universal Driver

Diamond's exclusive Universal Driver Software is included at no charge with the FeaturePak-DAQ1616. It provides a high-level programming library for all of our I/O boards, as well as for the data acquisition circuitry on our SBCs and Embedded-Ready Subsystems. All data acquisition features are supported by easy-to-use function calls, resulting in a reduced learning curve and shortened application development time. The Universal Driver works with Linux, Windows XP, Windows CE, and DOS. Application examples and projects are included for each function, each board, and each operating system, in order to provide a quick starting point for learning and development.

About the FeaturePak embedded I/O standard

The FeaturePak™ Initiative, originated by Diamond Systems, was launched at the Embedded World trade show in March, 2010. The FeaturePak Specification defines a highly-compact, low-profile, and inexpensive way to add configurable I/O functions to embedded systems. The tiny FeaturePak modules -- measuring just 1.70 x 2.55 inches (see photo above) -- can be used for providing snap-in options or upgrades for off-the-shelf single board computers (SBCs) and computer-on-module (COM) baseboards, or as building blocks to simplify the development of fully-custom embedded electronics. Additionally, FeaturePak modules provide "zero height expansion," in that they fit within the normal component envelope of an SBC or COM baseboard and add no height to PC/104-style I/O expansion stacks.